Buscar

 

RI UFLA (Universidade Federal de Lavras) >
Revistas UFLA >
CERNE >

Por favor, utilize esse identificador para citar este item ou usar como link: http://repositorio.ufla.br/jspui/handle/1/14670

Título: PRODUCTION OF LAMINATED VENEER LUMBER LVL USING VENEER OF Schizolobium amazonicum, Eucalyptus saligna AND Pinus taeda
Autor(es): Iwakiri, Setsuo
Matos, Jorge Luis Monteiro de
Pinto, Juliana Afonso
Viana, Lívia Cássia
Souza, Marina Moura de
Trianoski, Rosilani
Almeida, Vanessa Coelho
Assunto: Wood veneers, paricá, plywood
Publicador: CERNE
CERNE
Publicação: 13-Mai-2015
Outras Identificações: http://www.cerne.ufla.br/site/index.php/CERNE/article/view/125
Informações adicionais: This research evaluated the quality of laminated veneer lumber - LVL manufactured with veneers of Schizolobium amazonicum (paricá), Eucalyptus saligna and Pinus taeda. The LVL panels were manufactured in the laboratory conditions composed by seven veneers, 2,0 mm thickness, with different structural compositions, using phenol-formaldehyde resin. The veneers of Schizolobium amazonicum- paricá- were pre-classified by using stress wave machine. The veneers of Eucalyptus saligna and Pinus taeda were disposed in the face layer to reinforce the structural strength of LVL panels. The LVL quality was evaluated using glue line shear strength and static bending test (MOE and MOR, edge and flat). Grading of paricá veneers based on MOEd did not affected significantly the results of the glue line shear strength and MOE and MOR edge. For the MOE and MOR flat, the use of veneers of MOEd grade 1 contributed significantly to increasing the average values of these properties. In the same way, using the Eucalyptus saligna veneers on the face of LVL resulted in higher average values of MOE and MOR, edge and flat.
Idioma: por
Aparece nas coleções: CERNE

Arquivos neste Item:

Não há arquivos associados para este Item.

Itens protegidos por copyright, com todos os direitos reservados, Salvo indicação em contrário.


Mostrar estatísticas

 


DSpace Software Copyright © 2002-2007 MIT and Hewlett-Packard - Feedback