Please use this identifier to cite or link to this item: http://repositorio.ufla.br/jspui/handle/1/14155
metadata.revistascielo.dc.title: DECAY FUNGI RESISTANCE IN THERMALLY TREATED OSB PANELS
metadata.revistascielo.dc.creator: Mendes, Rafael Farinassi
Bortoletto Júnior, Geraldo
Garlet, Alencar
Almeida, Natalie Ferreira de
Surdi, Paula Gabriella
metadata.revistascielo.dc.subject: Wood panels, thermal treatment, production variables, biodeterioration.
metadata.revistascielo.dc.publisher: CERNE
CERNE
metadata.revistascielo.dc.date: 6-Apr-2016
metadata.revistascielo.dc.identifier: http://www.cerne.ufla.br/site/index.php/CERNE/article/view/935
metadata.revistascielo.dc.description: This study evaluated the effect of pre and post thermal treatment on the resistance of OSB panels to attack by decay fungi, and compared these two forms of thermal treatment with some production variables. The experimental design consisted of seven treatments, with the evaluation of two temperatures of pre thermal treatment of the particles (200 and 240 °C) for a 60 minutes period; post thermal treatment of the panels, produced with and without the application of paraffin, at 220 °C of temperature for a period of 12 minutes; and increasing the content of adhesive and application of paraffin in panels without thermal treatment. For each treatment three panels were produced with nominal density of 0.65 g/cm ³ and phenol-formaldehyde adhesive. By analyzing the results it was concluded that the panels with pre thermal treatment at 240 ° C presented great potential for inhibiting the attack of Trametes versicolor fungi and Gloeophyllum trabeum, but with equivalent effect to that obtained with the increasing the content phenol-formaldehyde adhesive. The post thermal treatment did not increase significantly the biological resistance of the OSB panels.  
metadata.revistascielo.dc.language: eng
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