Thermal properties of chipboard panels made of sugar cane bagasse (Saccharum officinarum L)

Abstract

The sugar cane bagasse is the most abundant agricultural residue produced in Brazil. It can be used for the production of chipboard panels and as constructive components for several types of environments. The substitution of timber for the bagasse minimizes environmental impacts and contributes to the generation of a new product with lower density and lower thermal conductivity which can improve the thermal conditioning of buildings. This study aims at determining the heat flow through chipboard panels made of sugarcane bagasse and comparing these chipboard panels with similar ones made of Pinus and Eucalyptus. The results show that the heat flow during the heating of the panels is lower for the panels made of sugar cane bagasse and the heat accumulation promoted by this panel is greater than by others. Therefore this product may be suitable to be used as liners, between cavity walls, partition walls and more.